2025 Moldex3D IC Packaging Technology International Conference
Date: September 9, 2025
Time: 9:45-16:30 (Check-in starts at 9:15 AM)
Location: WSICC, Hsinchu, Taiwan
With the rapid growth of AI computing, autonomous driving, and increasingly complex systems, advanced packaging has become a cornerstone of next-generation semiconductor innovation. The 2025 Moldex3D IC Packaging Technology International Conference will spotlight cutting-edge advancements in chiplet integration, high-speed interconnects, and heterogeneous design, demonstrating how simulation and Digital Twin technologies are now gaining significant momentum as the next breakthrough in semiconductor technology.
Key Focus Areas:
- Next-Gen Packaging Technologies: Explore advancements in Co-Packaged Optics (CPO), High Bandwidth Memory (HBM), and Fan-Out Panel-Level Packaging (FOPLP) for scalable, high-performance integration.
- CAE-Driven Innovation: Discover how simulation optimizes capillary underfill (CUF), equivalent bump group (EBG), and delamination analysis, while enabling breakthroughs in Nonlinear Warpage Control and Chip-on-Wafer-on-Substrate (CoWoS).
- Material Science & Process Optimization: Delve into the latest developments in Epoxy Molding Compound (EMC) and critical process parameters such as speed, pressure, and temperature control.
Join us to uncover how simulation enhances yield, performance, and development efficiency, accelerating the future of semiconductor packaging.
Agenda
| Time | Topic | Presenter |
| 09:15-09:45 | Registration | |
| 09:45-10:00 | Opening | Moldex3D |
| 10:00-10:40 | Digital Twin for Package Fabrication Process Design and Optimization |
National Cheng Kung University |
| 10:40-11:20 | Legendary Benchmark for Micro-Via Molding Prediction |
ASE Taiwan |
| 11:20-12:00 | 2.5D Package Under-Fill Simulation |
Sanyu Rec Japan |
| 12:00-13:30 | Lunch | |
| 13:30-14:00 | Cutting-Edge Advances in IC Packaging and Electronics Potting Simulation with Moldex3D | Moldex3D |
| 14:00-14:30 | Warpage and Buckling Prediction in Advanced Packaging: A Viscoelastic Simulation Workflow Using Moldex3D with Experimental Correlation |
Texas Instruments |
| 14:30-15:00 | Coffee Break | |
| 15:00-15:30 | Improving the Accuracy of Thermoset Viscosity Model for IC-Packaging |
Saeilo Japan |
| 15:30-16:00 | Flow and Deformation Challenges in Flip-Chip Packaging: Insights from CUF, MUF, and Warpage Simulation |
National Kaohsiung University of Science and Technology |
| 16:00-16:30 | Revolutionizing IC Packaging with AI: NeuroShine’s Journey from Lab to Fab |
National Cheng Kung University |
| 16:30 | Closing |
Venue
暐順國際會議中心(WSICC)
新竹縣竹北市復興三路二段168號20樓 (Google地圖)
- －搭乘高鐵或火車：從高鐵新竹站2號出口步行約2分鐘，或從台鐵六家站步行約1分鐘即可抵達WSICC
- －停車資訊：免費停汽/機車，停車場入口位於「高鐵二路」上
Sign-Up Form
Contact
台北營業部 邱小姐
leonachiu@moldex3d.com
02-89690299 #10
新竹營業部 廖小姐
rinnaliao@moldex3d.com
03-5600199 #635
台中營業部 徐小姐
mikohsu@moldex3d.com
04-23026968 #223
台南營業部 呂小姐
vanessalu@moldex3d.com
06-2826188 #222