2025 Moldex3D IC Packaging Technology International Conference
Date: September 9, 2025
Time: 9:50-16:30 (Check-in starts at 9:20 AM)
Location: WSICC, Hsinchu, Taiwan
Time: 9:50-16:30 (Check-in starts at 9:20 AM)
Location: WSICC, Hsinchu, Taiwan
With the rapid growth of AI computing, autonomous driving, and increasingly complex systems, advanced packaging has become a cornerstone of next-generation semiconductor innovation. The 2025 Moldex3D IC Packaging Technology International Conference will spotlight cutting-edge advancements in chiplet integration, high-speed interconnects, and heterogeneous design, demonstrating how simulation and Digital Twin technologies are now gaining significant momentum as the next breakthrough in semiconductor technology.
Key Focus Areas:
- Next-Gen Packaging Technologies: Explore advancements in Co-Packaged Optics (CPO), High Bandwidth Memory (HBM), and Fan-Out Panel-Level Packaging (FOPLP) for scalable, high-performance integration.
- CAE-Driven Innovation: Discover how simulation optimizes capillary underfill (CUF), equivalent bump group (EBG), and delamination analysis, while enabling breakthroughs in Nonlinear Warpage Control and Chip-on-Wafer-on-Substrate (CoWoS).
- Material Science & Process Optimization: Delve into the latest developments in Epoxy Molding Compound (EMC) and critical process parameters such as speed, pressure, and temperature control.
The day after this conference wraps up, SEMICON Taiwan 2025 (Sep 10-12, 2025) will be held in Taipei, providing international attendees with a wonderful opportunity to experience two major semiconductor events within the same week during their stay in Taiwan. Themed ‘Breaking Limits: Powering the AI Era’, SEMICON Taiwan 2025 showcases how members of the semiconductor community collaborate to drive the unstoppable wave of AI.
Join us to uncover how simulation enhances yield, performance, and development efficiency, accelerating the future of semiconductor packaging.
Join us to uncover how simulation enhances yield, performance, and development efficiency, accelerating the future of semiconductor packaging.
線上報名
聯絡資訊
台北營業部 邱小姐
leonachiu@moldex3d.com
02-89690299 #10
新竹營業部 廖小姐
rinnaliao@moldex3d.com
03-5600199 #635
台中營業部 徐小姐
mikohsu@moldex3d.com
04-23026968 #223
台南營業部 呂小姐
vanessalu@moldex3d.com
06-2826188 #222