江國寧
清華大學動力機械系 講座教授

Professor K. N. Chiang received his Ph.D. degree from the Georgia Institute of Technology, USA. Currently, he is the Chair Professor and Director of the Advanced Packaging Research Center of the National Tsing Hua University in Hsinchu, Taiwan. From 2010 to 2013, he served as Director of the National High-Performance Computing Center, which is the National Strategic Research Center of Taiwan. He has received three outstanding research awards from the Ministry of Science and Technology of Taiwan and has published more than 300 technical papers in SCI journals and conference proceedings. He has awarded more than 40 invention patents. Currently, he is Editor-in-Chief of the Journal of Mechanics (SCI), Senior Area Editor of the IEEE Transactions on Component, Packaging and Manufacturing Technology (SCI), and he was the Associate Editor of the 4 SCI Journal and the board member of IEEE-EPS.

He has made great achievements in simulation-based science and technology. He successfully combined simulation design with artificial intelligence technology and applied it effectively to semiconductor-related designs. His technology has greatly reduced product development time and development costs. Currently, Professor Chiang is the Chairman of Society of Theoretical and Applied Mechanics, Taiwan. He is the IEEE / ASME / STAM Fellow and the Academician of International Academy of Engineering (IAE), Russia.

徐志忠
科盛科技 部門協理

Jim畢業於國立清華大學化學工程博士，他目前負責科盛科技產品處求解器開發部門的研發。在過去幾年中，Jim與客戶密切合作，合作過知名廠商，如矽品、日月光、聯測等，為客戶提供技術解決方案，以滿足產品開發時的需求。專業領域為開發數值模型，模擬實際成型過程，如IC封裝模擬、複合材料成型模擬，多相流成型模擬和，計算流體動力學，黏彈性應力鬆弛和結構變形的多物理行為。與團隊共同開發項目，構建數值模型和用戶工作流程，以提供高效能準確的軟體。他在射出成型，流體輔助射出成型和IC封裝等高分子加工領域擁有多項技術論文和產品專利。

黃聖杰
成功大學機械工程學系 教授

黃聖杰教授1992年從美國伊利諾大學獲得博士學位後即回台灣成功大學機械系任教，其所從事之研究領域為IC封裝、塑膠加工、3D列印的製程模擬、機台發展與新技術開發。他在IC封裝領域的研究已有近30年經驗，主要是發展塑膠封裝模擬分析技術，由塑膠封裝模流分析著手，發展IC封裝體熟化後的翹曲變形預測及後熟化製程模擬，他所發展出來的P-V-T-C翹曲變形預測方法及後熟化分析方法目前已被證明有效且廣泛應用於業界。

李嘉炎
科盛科技 協理

Chia-Yen Lee received a Ph.D. in Power Mechanical Engineering from National Tsing Hua University, and started working in electronic packaging and assembly industrial over 10 years. During more than 10 years working experience, he has very deep and wide exposure from TSMC (foundry) as a technical manager for 3DIC packaging simulation, Delta Electronics (system) as a technical manager for power packaging design to Infineon Singapore (IDM) as a manager for packaging roadmap development. Until now, He held a total of 13 U.S. patents and published 3 SCI journal papers and 11 technical conference papers on electronic packaging field.

施孟鎧
日月光集團研發中心 部經理

Meng-kai Shih is a department manager with Product Characterization of Corporate R&D Center and currently leading the Stress-Thermal Analysis Lab development of System in Package, Panel Fan out technology , 2.5DIC product development, including package-level stress, thermal dissipation analysis and board-level structure reliability prediction at Advanced Semiconductor Engineering Inc. (ASE Group). He received the Ph.D. degree in Mechanical Engineer from the National Chung Cheng University, Chia-Yi, ROC, in 2006.

Dr. Shih has over 10 years of research focusing on finite element simulation and analysis electronic packaging manufacturing process, micro-force testing methods and IC failure mode analysis. Besides, he has over 30 technical publications of SCI journal and international conference papers. , and also is the inventor of more than 10 patents in US, China and Taiwan.

楊琮富
台灣納美仕電子材料 業務經理

曾任職於工研院電光所電子構裝組製程工程師，台積電IIPD TSV module assembly技術副理。在2007年至2013年間，發表數篇半導體封裝領域相關之論文於ECTC, ICEP等研討會及Soldering & Surface Mount Technology, IEEE Transactions on Components, Packaging and Manufacturing Technology等期刊論文。在2011年，獲ICEP研討會，Outstanding Technical Paper Award。目前任職於台灣納美仕電子材料，擔任業務經理。