Heterogeneous Integration – An overview

胡迪群
希鐠科技 執行長

胡迪群博士畢業於美國麻省理工學院材料科學系。現為希鐠科技股份有限公司的執行長。胡博士有豐富的研發以及管理的經驗。他是台灣的面板產業開創者之一。曾經服務過元太科技以及瀚宇彩晶，負責產品及技術的開發。他曾在美國IBM公司以及工業技術研究院的電子構裝部門服務過。他也曾執教於交大材料研究所。胡博士和台灣電子構裝的產業有深厚的淵源及貢獻。他曾發表有多篇論文在國外知名期刊並擁有100多項專利。

AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging

江國寧
清華大學動力機械系 講座教授

Professor K. N. Chiang received his Ph.D. degree from the Georgia Institute of Technology, USA. Currently, he is the Chair Professor and Director of the Advanced Packaging Research Center of the National Tsing Hua University in Hsinchu, Taiwan. From 2010 to 2013, he served as Director of the National High-Performance Computing Center, which is the National Strategic Research Center of Taiwan. He has received three outstanding research awards from the Ministry of Science and Technology of Taiwan and has published more than 300 technical papers in SCI journals and conference proceedings. He has awarded more than 40 invention patents. Currently, he is Editor-in-Chief of the Journal of Mechanics (SCI), Senior Area Editor of the IEEE Transactions on Component, Packaging and Manufacturing Technology (SCI), and he was the Associate Editor of the 4 SCI Journal and the board member of IEEE-EPS.

He has made great achievements in simulation-based science and technology. He successfully combined simulation design with artificial intelligence technology and applied it effectively to semiconductor-related designs. His technology has greatly reduced product development time and development costs. Currently, Professor Chiang is the Chairman of Society of Theoretical and Applied Mechanics, Taiwan. He is the IEEE / ASME / STAM Fellow and the Academician of International Academy of Engineering (IAE), Russia.

An Integrated IC Package Molding Simulation Solution on Advanced Packaging

徐志忠
科盛科技 研發一處處長

Jim畢業於清華大學化學工程博士，他目前負責科盛科技產品處求解器開發部門的研發。在過去幾年中，Jim與客戶密切合作，合作過知名廠商，如矽品、日月光、聯測等，為客戶提供技術解決方案，以滿足產品開發時的需求。專業領域為開發數值模型，模擬實際成型過程，如IC封裝模擬、複合材料成型模擬，多相流成型模擬和，計算流體動力學，黏彈性應力鬆弛和結構變形的多物理行為。與團隊共同開發項目，構建數值模型和用戶工作流程，以提供高效能準確的軟體。他在射出成型，流體輔助射出成型和IC封裝等高分子加工領域擁有多項技術論文和產品專利。

Packaging Simulation Starting from Mold Filling – Achievements and Challenges

黃聖杰
成功大學機械工程學系 教授

黃聖杰教授1992年從美國伊利諾大學獲得博士學位後即回台灣成功大學機械系任教，其所從事之研究領域為IC封裝、塑膠加工、3D列印的製程模擬、機台發展與新技術開發。他在IC封裝領域的研究已有近30年經驗，主要是發展塑膠封裝模擬分析技術，由塑膠封裝模流分析著手，發展IC封裝體熟化後的翹曲變形預測及後熟化製程模擬，他所發展出來的P-V-T-C翹曲變形預測方法及後熟化分析方法目前已被證明有效且廣泛應用於業界。

Engineering Simulation Integrated Smart Manufacturing in Semiconductor Assembly

胡逸群
日月光集團研發 專業技術副理

Ian 自成功大學獲得機械工程博士後即加入日月光集團工作迄今，他目前負責日月光集團研發中心及高雄廠之熱傳/模流分析與驗證工作。專業領域包含封膠製程開發與模流分析、封裝產品熱設計與驗證、應力分析與DIC技術等。已發表超過40篇期刊/研討會論文，且已申請超過40件產品專利。

Moisture Effect on Physical Failure of Plastic Molded SiP Module – A case Study

李長斌
宜特科技 國際工程發展處協理

Jeffrey Lee received the M.S. degree from the Applied Chemistry Department and the EMBA degree from Chiao Tung University, Hsinchu. Prior work was in ITRI, Siliconix Vishay, ASE Corp RD, He serves currently as an Assistant Vice-President with iST-Integrated Service Technology Inc., Hsinchu, Taiwan.

His main works are to develop global open collaboration engineering projects for semiconductor and information communication technology (ICT) related quality and reliability technology with branding customer and industry alliance. Currently, he is focusing more on electronics industry standard development with global alliance and standard committee in IPC, JEDEC and SEMI.

Mr. Lee was a recipient of the Best Paper Award of SMTA China in 2010 and Outstanding Paper Award of ICEPT in 2018. He was also awarded the IPC Distinguished Committee Member for IPC9709 in 2014 and IPC8921 in 2020 by the IPC Standard Committee, He is also a Board Member of IMAPS Taiwan Chapter, and a member of IPC and JEDEC, the SMTAI Technical Committee, the TPCA Technical Committee, and the 001 CSE (Certified Standard Expert) of IPC.

• 戶名：科盛科技股份有限公司
• 帳號：96270118923100
• 銀行：彰化銀行 北新竹分行
• 銀行代號：009

• 戶名：科盛科技股份有限公司
• 帳號：19447254