Design Quality Plastic Products Effortlessly with 100% confidence!
|Wednesday, May 23rd ~ Thursday, May 24th
||University of Massachusetts Lowell
Lowell, MA 01854
Agenda (May 23rd)
09:00am–10:00am Moldex3D eDesignSYNC for CAD demo including private cloud
10:00am–11:00am Moldex3D-FEA Interface with Abaqus or Mold simulation and FEA integration
11:00am–12:00pm Novel Simulation of MuCell® Process Technology – How to reduce part cost through MuCell process
12:00pm–13:00pm Lunch Break
13:00pm–14:00pm Conformal Cooling – How to reduce cycle time of up to 40% and increase mold life for injection molding
14:00pm–15:00pm Advanced Hot Runner – How to realize “Green Molding” without sacrificing cost and quality requirements?
Agenda (May 24th)
GET A FREE ANALYSIS: Attendees may provide CAD files of molds for use in the demonstrations. Contact firstname.lastname@example.org to arrange for this service
Mr. Kudchadkar has received a BE (Polymer Engineering) from University of Pune, India and a MS (Plastics Engineering) from UMass Lowell. He has over 7 years of experience in applying injection molding simulation to optimize parts, hot-runners, and molds and troubleshoot molding problems. Vijay has performed over 500 simulations on injection molded parts, hot-runners, and molds. He is proficient with molding simulation CAE packages. Vijay has numerous publications and four (4) patents in plastics processing.
|Dr. Anthony Yang
Dr. Anthony Yang has been the core developer of Moldex3D and Board Member of the Moldex3D company. Dr. Yang is currently at the position of Chief Technology Officer to devote his time in coordinating between the users and development team. With his dedicated contribution, the first 3D solvers for molding process commercial software, were then developed and populated by the industry worldwide. His development achievement is truly magnificent as most active Moldex3D users have been utilizing the 3D solvers founded upon the kernels developed by Dr. Yang for almost 10 years. Dr. Yang received his PhD degree in chemical engineering from Taiwan National Tsing-Hua University and has more than ten years experiences in computer simulation and IC encapsulation research. Dr. Yang has published up to 50 papers globally from his field of study and received the simulation CAE patents in Taiwan.
session is over.