2024 Moldex3D IC Packaging Technology International Conference

  • 日期 :2024年 7月 2日
  • 地點 : 新竹




台元科技園區 一期劇場式會議中心


In IC manufacturing, leveraging numerical simulation for predictive analysis is crucial for enhancing yield rates and success in advanced packaging technologies like 2.5D and 3D-IC configurations. The complex assembly and packaging processes involve various challenges, such as defects and warpage issues due to thermal and chemical shrinkage. Numerical simulation through CAE helps identify and address these challenges, improving process design and methodologies and ultimately leading to higher yield rates.

To keep up with the industry’s needs, Moldex3D offers IC Packaging solutions that help chip designers thoroughly analyze the chip encapsulation process from filling, curing, and cooling to advanced manufacturing demands, such as wire sweep, die shift, filler concentration, underfill encapsulation, post-molding curing, stress distribution, and structural evaluation. In addition to IC Packaging, Moldex3D’s product line — Electronic Potting, makes it possible to model the fluid dynamics during the potting process, effectively predicting the location and size of air traps. With Moldex3D IC Packaging and Electronic Potting simulation, significant molding problems can be predicted and solved in advance. Engineers can thus enhance the quality of the chip and efficiently prevent potential defects. Moreover, our accurate simulation helps optimize the design and reduce costs.

To further explore the applications of Moldex3D IC Packaging in the semiconductor industry, we are excited to announce the 2024 Moldex3D IC Packaging Technology International Conference. This event, scheduled on July 2nd in Tai Yuen Hi-Tech Industrial Park, Hsinchu, Taiwan, is a unique opportunity for you to join and listen to our esteemed speakers shedding light on the latest trends and technologies in advanced packaging and simulation solutions. If you’re interested, don’t hesitate to sign up for this event. We look forward to your participation at the 2024 Moldex3D IC Packaging Technology International Conference!





Mass Production Advanced IC packaging
  • Strip-level packaging
  • Wafer-level packaging
  • Panel-level packaging
  • Multi-chip structure
  • 2.5D, 3D IC architecture



Time Topic Presenter
09:20-09:50 Registration​  
09:50-10:00 Opening​ Dr. David Hsu
Chairman and CTO of Moldex3D
10:00-10:40​ Technologies for Heterogeneous Integration in the GAI Era Dr. Dyi-Chung Hu
CEO of SiPlus
10:40-11:20 Numerical Modeling of Capillary Underfill in Direct Chip Attach Packages Jin-Yuan Lai
Micron Semiconductor Asia Operations Singapore
11:20-12:00 Underfill Material for Narrow Gap PKG Kazuki Noguchi
Sanyu Rec Japan
12:00-13:30 Lunch  
13:30-14:00 Harnessing the Power of Simulation: Exploring Moldex3D’s Enhanced Numerical Tools in Advanced IC Packaging Dr. Leo Shen
Senior Manager of Moldex3D R&D Division
14:00-14:30 Modeling Fabrication Process of IC Packages Dr. Sheng-Jye Hwang
Professor of Dept. of Mechanical Engineering, NCKU
14:30-15:00 Encapsulation Reliability of EMC Phenomenon and Tool Prediction  Jed Chien
ASE Taiwan
15:00-15:30 Coffee Break  
15:30-16:00 Mold Flow Analysis for Multi-Chip Packages Oscar Chuang
Industrial Technology Research Institute (ITRI)
16:00-16:30 Advancing the Frontiers Molding Simulation with Accurate Material Properties  Dr. Joe Wang
Manger of Moldex3D Material Measurement Center
16:30 Closing  

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